LED circuit board with good heat dissipation performance

一种具有良好散热性能的led线路板

Abstract

一种具有良好散热性能的LED线路板,其包括LED灯、线路层、绝缘层和基板,所述LED灯的脚通过线路焊盘焊接在线路层,所述绝缘层位于所述线路层和所述基板之间,所述LED灯下有散热焊盘,所属线路层和所述绝缘层对应处有开口,所述散热焊盘穿过所述线路层和所述绝缘层的开口直接与所述基板接触。本实用新型将传统的线路板中间影响导热性能的绝缘层去除,使零件的热量直接通过导热物质传递到导热基板上,增加了导热效率。
The utility model provides an LED circuit board with good heat dissipation performance, which comprises an LED lamp, a circuit layer, an insulation layer and a baseplate, wherein the feet of the LED lamp are welded on the circuit layer through a circuit bonding pad; the insulation layer is positioned between the circuit layer and the baseplate; a heat dissipation bonding pad is arranged below the LED lamp; opposite openings are respectively formed on the circuit layer and the insulation layer; and the heat dissipation bonding pad passes through the openings on the circuit layer and the insulation layer and is in direct contact with the baseplate. In the LED circuit board with good heat dissipation performance, the insulation layer that influences the thermal conduction in the middle of a traditional circuit board is removed, so that the heat of parts is directly transferred to the heat conducting baseplate through heat conducting substances, thereby improving the heat conducting efficiency.

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (0)

    Publication numberPublication dateAssigneeTitle

NO-Patent Citations (0)

    Title

Cited By (0)

    Publication numberPublication dateAssigneeTitle